Tata Group, to Construct Rs 25,000 Crore Semiconductor Packaging Plant


Tata Group, to Construct Rs 25,000 Crore Semiconductor Packaging Plant
A semiconductor packaging plant, valued at approximately Rs 25,000 crore, is set to be constructed in Assam through a collaboration between the state government and the Tata Group, as announced by Union Minister Rajeev Chandrasekhar. Speaking at the inaugural 'Digital India Future Skills Summit' in Guwahati, the minister highlighted that the leadership of Chief Minister Himanta Biswa Sarma played a crucial role in the establishment of this semiconductor facility in partnership with the Assam government and Tata Group. This development is expected to provide employment opportunities in the semiconductor industry for the youth of the state.
"We will soon obtain all approvals and submit it to the cabinet for final approval. Young Indians aspiring to enter the world of semiconductors won't have to leave their state or travel to other cities anymore," he added. The minister emphasised how India's economy has undergone significant progress over the past decade, from being 'Fragile 5' to now ranked as the world's 'Top 5' economy. The significant milestone under the leadership of Prime Minister Narendra Modi has unleashed many opportunities for young Indians, particularly in emerging technology sectors where the country is on the same starting line as the rest of the world. 
"Through Future Skills, we want to convey to young Indians that in the coming years, due to the policies of PM Modi, numerous opportunities will open up for them. Students need to empower and equip themselves with skills in areas such as AI, cybersecurity and semiconductors," he emphasised. The world's biggest companies in these fields, including Nvidia, Intel, AMD, HCL, Wipro, and IBM, are present in Guwahati.
The summit's goal is to inspire young Indians to deeply engage in skill development, according to the minister. Prime Minister Modi has introduced a comprehensive three-part strategy, including 'futureDESIGN' for design innovation, 'futureLABS' for innovation within systems, and 'futureSKILLS' to equip young Indians with capabilities in emerging sectors. The summit played a pivotal role in facilitating over 30 strategic collaborations between the National Institute of Electronics and Information Technology (NIELIT) and prominent industry players and academic institutions such as Intel, HCL, Wipro, Microsoft, Kyndryl, IIM Raipur, and IIITM Gwalior, among others.
Source: IANS