IIT Kanpur, Conlis Global Partner to License Innovative Bone Healing Technology


IIT Kanpur, Conlis Global Partner to License Innovative Bone Healing Technology
The Indian Institute of Technology (IIT) Kanpur has entered into a Memorandum of Understanding (MoU) with Conlis Global, a Canada-based biotechnology company, for the licensing of an innovative technology focused on promoting bone healing and regeneration. The technology, known as Hydroxyapatite-based Porous Composite Scaffolds, is biodegradable and possesses osteoinductive and osteopromotive properties essential for bone regeneration.
These scaffolds demonstrate high biocompatibility, facilitating positive interactions with osteoblast cells responsible for bone formation and remodelling. The technology acts as a carrier for bone-active biomolecules, delivering them directly to the implant site. According to Prof. Ashok Kumar from the Department of Biological Sciences & Bioengineering at IIT Kanpur, the material offers a promising approach for reconstructing and repairing bone defects while addressing drawbacks associated with existing technologies.
The functionalized scaffolds can be utilized in large-size bone defects without compromising connectivity, structural integrity, or oxygen and blood circulation, thereby enhancing tissue formation, mineralization, and rapid defect healing. This technology can serve as a bone substitute, overcoming limitations associated with autografts.
The primary objective is to overcome drawbacks of existing remedies, with this technology providing a versatile approach for delivering bone-active molecules, antibiotics, or other drugs to combat bone pathologies, reconstruct irregular bone defects, and address dental applications. 
Conlis Global expressed excitement about the partnership with IIT Kanpur, emphasizing the innovative solution's potential to advance the treatment of bone and joint disorders. Dr. Sumrita Bhat, CEO of Conlis Global, looks forward to bringing this solution to the market to benefit patients worldwide.