HFCL Partners with MediaTek to Integrate Chipset for Indoor 5G Solution
HFCL Limited, a technology enterprise and communications solution provider, has teamed up with chip-maker MediaTek to integrate its chipset with an indoor 5G solution. The collaboration aims to assist telecom operators in tackling last-mile connectivity challenges.
HFCL's 5G FWA Indoor CPE, powered by the MediaTek T750 chipset, offers an ultra-compact form factor and minimal power consumption. The chipset, built on 7nm technology, features a 5G radio and quad-core Arm CPU, ensuring seamless connectivity across multiple devices with dual-band 4x4 Wi-Fi 6 support.
Mahendra Nahata, Managing Director of HFCL, stated, "The HFCL 5G FWA Indoor CPE helps telecom operators address the last-mile connectivity challenges in an ultra-compact form factor and provides a fibre-like experience to both consumers and enterprises".
The HFCL 5G solution boasts a 2.5 Gbps Ethernet interface for high-speed data transfer and includes an embedded eSIM. It is designed as a plug-and-play device with an AI-integrated mobile app for user-friendly self-installation and signal optimization.
Evan Su, General Manager of Wireless Communications at MediaTek, emphasized, "This partnership is another endeavor to support the Indian government’s vision of creating a sustainable telecom ecosystem by promoting local manufacturing".
The collaboration aligns with the goal of advancing local manufacturing to bolster India's telecom infrastructure. Industry estimates suggest that the global 5G last-mile equipment market is poised to reach $68 billion by 2030.
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