ON Semiconductor Introduces Two New Integrated Power Modules

ON Semiconductor, a leading semiconductor solutions company, launches its two new Power Modules. Providing excellent energy efficiency, reliability and performance in highly integrated & compact packaging, these new modules add to the company’s strong portfolio of power semiconductor devices. Both the Power Modules will be demonstrated at ON Semiconductor’s booth during ‘electronica’, a global leading trade fair and conference for electronics that is happening at Munich, Germany from 13-16th November, 2018.

The new NXH160T120L2Q1SG and NXH160T120L2Q2F2SG Power Integrated Modules (PIMs) will significantly reduce the designer’s challenge by providing compact, highly integrated solutions in easily mountable packages that save space and reduce costs. Targeting mainly towards 30KW & 50KW inverters, , these new power modules enable designers to trade-off between low VCE(SAT) and low EON / EOFF losses to fully optimize circuit performance by integrating field stop trench IGBTs and fast recovery diodes that offer lower conduction and switching losses.

On the occasion, ON Semiconductor also announced the launch of FDMF3170, a fully optimized, ultra-compact Smart Power Stage (SPS) multi-chip module for DC-DC buck converter applications that can be used in servers, data centers, artificial intelligence accelerators and telecommunications equipment. This state-of-the-art converter integrates two high performance power MOSFETs based on ON Semiconductor’s PowerTrench technology, and a smart driver featuring a high precision current sensor for maximum performance from the processor.

Established in 1999, ON Semiconductor drives energy efficient innovations and empowers customers to reduce energy usage by aiding engineers in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. Being a leading supplier in semiconductor-based solutions, it has a comprehensive portfolio of energy efficient, power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices.

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